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Siemens SIMATIC ET 200SP Interface Module IM 6ES7 155-6AU01-0BN0 – PROFINET High Feature Interface Module for Distributed I/O

Name: Siemens SIMATIC ET 200SP Interface Module IM 6ES7 155-6AU01-0BN0 – PROFINET High Feature Interface Module for Distributed I/O
Brand: SIEMENS
SKU: 775
Price: 40000.00 INR
Availability: InStock

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Parameter Details
Make:- SIEMENS
Product Series:- SIMATIC ET 200SP
Module Type:- Interface Module (High Feature)
Part Number:- 6ES7 155-6AU01-0BN0
Communication:- PROFINET IO (IRT)
Ethernet Ports:- 2 x RJ45 (Integrated Switch)
Topology:- Line / Star
Redundancy:- MRP Support
Shared Device:- Supported
Hot Swap:- Supported
Mounting:- DIN Rail
Operating Voltage:- 24 V DC
Protection Class:- IP20
Operating Temperature:- 0°C to 60°C
Configuration:- TIA Portal
Application:- High-speed Distributed I/O Systems
Country of Origin:- Made in Germany
Condition:- New Without Box (As Per Photos)
Shipping:- Fast & Safe Worldwide Shipping Available.

Brand	SIEMENS
Category	MODULE

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High-Feature PROFINET interface for ET 200SP distributed I/O
Supports Isochronous Real-Time (IRT) communication
Integrated 2-port switch for line topology
Handles large I/O configurations with fast update times
Supports Shared Device and MRP (Media Redundancy Protocol)
Hot swapping of I/O modules without system shutdown
Compact design for DIN-rail mounting inside control panels
Ideal for high-speed, high-availability industrial automation systems

The Siemens SIMATIC ET 200SP Interface Module IM 155-6AU01-0BN0 is a high-performance PROFINET interface designed for the modular ET 200SP distributed I/O system. This High-Feature (HF) IM enables ultra-fast, deterministic communication with PLCs over PROFINET including support for Isochronous Real Time (IRT), making it ideal for motion control, synchronized processes, and time-critical automation tasks.

With an integrated 2-port Ethernet switch, the module allows simple line topology wiring without external switches. It supports advanced features such as Shared Device, Media Redundancy Protocol (MRP), and hot swapping of I/O modules—ensuring maximum plant availability and minimal downtime.

This interface module is widely used in machine building, process plants, panel building, and OEM automation where reliable, high-speed distributed I/O communication is essential.